| 第 41 卷第 5 期 |  | Vol. 41 No. 5 | | 2011 年 10 月 | Oct 2011 |
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所屬欄目：功能材料
環(huán)氧樹(shù)脂E-44反應增容尼龍6／廢印刷電路板非金屬粉復合材料的力學(xué)性能和熱變形溫度研究 |
| 歐陽(yáng)杰1，李 淵1，王 曦1，孟 勇2，蘇勝培1，2*
（1． 資源精細化與先進(jìn)材料湖南省普通高校重點(diǎn)實(shí)驗室，湖南 長(cháng)沙 410081；2． 湖南師范大學(xué) 資源循環(huán)綜合技術(shù)研究中心，湖南 長(cháng)沙 410081） |
| 摘 要：用環(huán)氧樹(shù)脂E-44作為反應性的增容劑，采用熔融共混方法制備了尼龍6（PA6）／廢印刷電路板非金屬粉（N-PCB）復合材料。研究了E-44用量、擠出溫度以及N-PCB粉末的粒徑大小對PA6／N-PCB復合材料力學(xué)性能和熱變形溫度的影響。對復合材料抽提殘留物的紅外分析實(shí)驗結果表明E-44與PA6／N-PCB復合材料中PA6以及N-PCB粉末表面發(fā)生了化學(xué)鍵合。添加1.25份E-44的PA6／N-PCB復合材料與純PA6相比，其拉伸強度、拉伸模量、彎曲強度和彎曲模量最大增幅分別為 29%、49%、73%和72%，熱變形溫度提高了42.8℃，但其韌性降低。與未加增容劑相比，其拉伸強度、彎曲強度和缺口沖擊強度最大增幅分別為 9%、8%和43%，熱變形溫度提高了9.3℃。 |
| 關(guān)鍵詞：環(huán)氧樹(shù)脂（E-44）；尼龍6；廢印刷電路板非金屬粉；增容 |
| 中圖分類(lèi)號：TQ325 文獻標識碼：A 文章編號：1009-9212（2011）05-0061-06 |
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| Study on the Mechanical and Heat Distortion Temperature of Polyamide 6／Nonmetals Recycled from Waste PCB Composites Compatibilized by Epoxy Resin（E-44） |
| OUYANG Jie1，LI Yuan1，WANG Xi1，MENG Yong2，SU Sheng-pei 1，2*
（1. College of Chemistry and Chemical Engineering，Key Lab of Sustainable Resources Processing and Advanced Materials，Hunan Normal University，Changsha 410081，China；2. College of Chemistry and Chemical Engineering，Recycling Integrated Technology Research Center，Hunan Normal University，Changsha 410081，China） |
| Abstract：Polyamide 6（PA6） matrix composites，reinforced with nonmetals recycled from waste printed circuit boards（N-PCB）and compatibilized with epoxy resin（E-44），was prepared by the melt blending method. The effects of E-44 dosage，extrusion temperature and N-PCB particle sizes on the mechanical properties and heat distortion temperature of PA6／N-PCB composites were investigated. The results showed that there were chemical reactions occurred between the components of PA6／N-PCB composites，proved by both FT-IR analysis and the extraction experiment. The maximum increment of tensile strength，tensile modulus，flexural strength and flexural modulus of the PA6／N-PCB composites were 29%，49%，73% and 72%，respectively，compared to that of pure PA6 while the heat distortion temperature increase by 42.8℃. However，the toughness of the composites was decreased. The tensile strength，flexural strength，impact strength and heat distortion temperature of PA6／N-PCB composites increased by 9%，8%，43% and 9.8℃，respectively，comparing to that without compatibilizer-E44.
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| Key words：epoxy resin（E-44）；polyamide 6；nonmetals recycled from waste PCB；compatibilization |
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基金項目： 湖南師范大學(xué)瀟湘學(xué)者啟動(dòng)資金資助課題（化050613）。
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作者簡(jiǎn)介：歐陽(yáng)杰（1987-），男，湖南株洲人，碩士研究生，研究方向：高分子復合材料。（E-mail：hnpjieouyang@gmail.com）
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聯(lián) 系 人： 蘇勝培，教授，博士生導師。（E-mail：sushengpei@gmail.com）
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收稿日期： 2011-08-3
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